This two part epoxy resin system that features low to moderate viscosity is well suited for potting, coating, and sealing electronic assemblies. It excels at bonding dissimilar substrates with different coefficients of expansion and has a wide service temperature range of -60ºF to 250ºF. The typical viscosity of Part A is 4,000 cps at 25ºC, and 10,000 cps at 25ºC for Part B. This system produces high strength castings, bonds, and seals which are highly resistant to thermal cycling and shock. Its bond strength is generally greater than 1,500 psi, and its tensile strength normally exceeds 1,100 psi.