Interplex’s new product is a discreet pick and place SMT component that creates a solderless edge card interconnection for daughter board applications. Theses SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection.
Joe Lynch, Interplex’s Director of Advanced Product Development commented, “We continue to expand our press-fit technology to meet the ever evolving needs of our customers. As new applications emerge, Interplex will search for new ways to solve challenging problems by eliminating unnecessary processes and providing the most robust interconnect solution.
The SMT Card Edge Contact System is designed for standard 1.6 mm (0.062”) thick printed circuit boards (PCB’s) but is compatible with additional PCB thicknesses. The center minimum PCB spacing is 3.2 mm (0.126”).
The product features Interplex’s proven and tested 0.64 mm press-fit technology. It is packaged in a 16 mm x 4 mm pitch EIA tape on a 13” diameter plastic reel for compatibility to standard high-speed surface mount pick-and-place equipment. It is suitable for high-conductivity material, able to carry up to 15 amps per contact.
Interplex Engineered Products