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Home > New Edge Card Socket Combines High Density with Lower Cost

New Edge Card Socket Combines High Density with Lower Cost

Samtec’s line of high-speed edge card solutions now includes a new high-density edge card socket (BEC5C Series) featuring up to 140 total contacts on 0,50 mm pitch. This micro card socket is ideal for high-speed applications requiring b oard space savings. The dual beam bi-level contact system is on a staggered 0,5 mm pitch, which reduces card-mating force without reducing reliability. This vertical socket is available for both .062" (1,60 mm) and .093" (2,36 mm) card thicknesses. 

For more information, visit www.samtec.com [1].

 

 

Content Item Type: 
Product Announcement [2]
Meta Canonical URL: 
http://www.mdtmag.com/product-releases/2013/10/new-edge-card-socket-combines-high-density-lower-cost
Summary: 

Samtec’s line of high-speed edge card solutions now includes a new high-density edge card socket (BEC5C Series) featuring up to 140 total contacts on 0,50 mm pitch.

Contributed Author: 
MDT Staff
Product/Service Categories: 
Connectors [3]
Legacy NID: 
201 851

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Source URL: https://www.mdtmag.com/product-releases/2013/10/new-edge-card-socket-combines-high-density-lower-cost

Links
[1] http://www.samtec.com
[2] https://www.mdtmag.com/content-item-types/product-announcement
[3] https://www.mdtmag.com/product-categories/packaging-and-interconnects/connectors