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MaxiFlow heat sinks are designed for cooling BGAs and other hot components in the restricted air flow conditions typical of today’s condensed electronic packages. The heat sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. They are fabricated from extruded aluminum which minimizes thermal resistance from the base to the fins, reduces weight, and keeps costs low. Tests on maxiFlow heat sinks using an air flow rate of just 100 lfm (linear feet per minute) show that device junction temperatures can be reduced by more than 40% below the temperatures achieved using other heat sinks.

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