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This fiber-coupled diode laser solution—the next-generation L4 platform—leverages an innovative chip design to generate 10 W of output power. Its packaging takes up less space compared to previous designs, enabling OEMs to pack more diode lasers into a smaller space within their systems. The diode lasers are designed for use in a broad range of industrial, medical and dental applications. Features of the L4 platform include expanded fiber delivery options; smaller, more efficient package; new electrical format; and improved wavelength flexibility.
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