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Sarcon GR-Fd thermal interface gap filler pad is a unique gel-like material. It is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. The true-to-form gap filler pad is easier to install and increases productivity compared to non-reinforced alternatives. When placed between a heat source such as a high-performance semiconductor and a nearby heat sink, Sarcon GR-Fd will transfer heat with a thermal conductivity of 1.5 W/m°K and a thermal resistance ranging between 0.6 and 3.33°Cin2/W depending on material thickness.


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