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This brochure highlights the advanced manufacturing techniques used to create flexible printed circuits for today's sophisticated electronic applications. Special processes include the ability to selectively plate a single circuit with two different finishes, contoured circuits with variable metal thickness, semi-additive and subtractive techniques to manufacture trace patterns, BGA pad arrays, and open window or cantilevered contact leads. In addition, Tech-Etch offers surface mount technology (SMT) for component assembly on both prototypes and full production runs. Information: www.tech-etch.com/flex.
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