This polyurethane encapsulant, UR3005, exhibits very low moisture absorption and high elongation at low temperatures. A polybutadiene modified polyurethane, it has excellent moisture resistance with water pickup of less than 1% during immersion at 60°C. As a medium soft encapsulant, UR3005 induces very little stress on sensitive parts, like printed circuit board level components and associated solder joints. The adhesive gels in 10-20 minutes. Full cure is typically reached in 24 hours. Gel and cure times can be shortened or lengthened in special cases for customers on a custom basis.