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This innovative metallization process selectively plates injection molded parts with copper and nickel in order to create three-dimensional connections with multiple points of contact. This process is unique in that it allows for control of the metal deposition process to produce fine electronic traces with high resolution and yield. The circuitry is incorporated directly onto the plastic component, offering a wide range of innovative design possibilities, including the opportunity for miniaturization, parts consolidation, reduced assembly time, and cost reduction.


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