The COM.0 Revision 2.0 specification has dropped legacy interface and adopted two new pin-outs that make space for future technology trends. Legacy digital signaling like Parallel ATA and PCI are phased out to increase more I/O connects for Digital Displays, Serial ATA, PCI Express, USB 3.0, and other future-proof interface types. More PCI Express lanes mean better connectivity for more diverse applications. Advanced high speed I/O like SATA 3 and USB 3.0 are supported to provide volume data transmission capability for multimedia applications, and these new optimizations will make possible smaller form factors.
For flexible display connection, COM Revision 2.0 leaves dedicated pins for new DDI (Digital Display Interfaces). Without additional signal processing, DDI eliminates cable disorder and provides better anti-noise and exquisite resolution, compared with traditional analog signal interfaces. Multi-display requirements could be further extended by up to three DDI links through type six pin-outs. Aside from I/O extensions, power efficiency has improved, bringing the benefit of reduced maximum input power to 137 watt for types 2, 3, 4, 5, 6, and 68 watt for type 1 and 10. This allows re-use of some additional power pins for the above I/O extensions. Carrier boards that need to work with COM Revision 1.0 modules need to address this change during the design.