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Self-Adhesive Cooling Patch Eliminates HeatsinkA new thermal material breakthrough from Fujipoly allows engineers to reduce chip and circuit temperature by as much as 11% without the need for a heatsink.

The advanced four-ply, peel-n-stick FPDSEM 90 Cooling Patch offers the fastest and easiest way to radiate heat from an electronic component to the surrounding environment. The patch is applied like a sticker to the surface of any “hot spot.” The material can also be custom cut or trimmed to fit virtually any shape.

The low resistance Cooling Patch provides a thermal conductivity of 1.5 W/m°K and a thermal emissivity of 0.97. Fujipoly’s FPDSEM 90 is 25-mm thick and can be ordered in sheets, rolls, or kiss-cut rolls depending on the application.

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