Master Bond has developed a highly thermally conductive
epoxy system that is specially designed to help mitigate the issues associated
with tightly packed components and miniaturized electronic circuits. With a
thermal conductivity over 22 BTU/in/ft²/hr/ºF and serviceability from -60 to
400°F, Master Bond EP21ANHT delivers outstanding performance in the most
demanding microelectronic applications. The cured adhesive is also a superior
electrical insulator, further expanding its usefulness.
This two component adhesive, sealant, and coating has a
convenient 1:1 mix ratio by weight or volume and offers room temperature and
faster elevated temperature cures. EP21ANHT has a low coefficient of thermal
expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil,
and a tensile shear strength greater than 1,000 psi. It resists a wide range of
chemicals and adheres well to a variety of substrates.
EP21ANHT is available in pint, quart, gallon and 5 gallon