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High Performance, Low Resistance Gap Filler PadAn important consideration among electronics manufacturers is the damage that can be done to a thermal gap filler pad during delicate assembly and re-work operations. To help alleviate this problem, Fujipoly announces the availability of Sarcon® 50G-Hm. This high performance, low resistance gap filler pad is manufactured with a special low-tac top surface.

The unique, one-sided treatment is less sticky than the opposing surface allowing the thermal pad to adhere to either the target electrical component or opposing heat sink. This allows for quick and easy removal without ripping, warping or damaging the interface material. 

Sarcon® 50G-Hm transfers heat with a thermal conductivity of 6.0 W/m°K and a very low thermal resistance of .16°Cin2/W at 72.5 PSI.  This 0.5mm thick, flame retardant TIM is available in sheets up to 300mm x 200mm.

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