Fujipoly announces the availability of Sarcon® 25GR-T2d, a very soft highly conformable thermal interface medium that is suited for both low and high-volume production applications. The reinforced .25mm thick TIM also offers engineers a durable and economical solution for tight tolerance die-cut operations.
When placed between a heat source such as a semiconductor and a nearby heat sink, this Sarcon® gap filler pad provides a thermal conductivity of 1.5 W/m°K and a thermal resistance as low as .33 °Cin2/W.
Sarcon® 25GR-T2d is recommended for applications with operational temperatures between -40°C and +150°C. Convenient pre-cut sheets are available up to a maximum size of 200mm x 400mm.
Fujipoly America Corporation