Photofabrication Engineering (PEI) has expanded its manufacturing capabilities for custom-designed, photochemically-etched surface-mount and insert-mount lead frames for integrated circuit manufacturing. These lead frames are used in a wide variety of applications including semiconductors, glass-to-metal seals, and relays, as well as medical applications such as hearing aids.
Using base materials such as kovar, nickel-iron alloys, copper alloys, and pure nickel, PEI can plate lead frames in their entirety or selectively. Lead-free plating materials include silver, nickel, gold, or tin, depending on the customer’s specific electrical and thermal conductivity requirements. Since the lead frame is the main conduit by which heat flows from the chip to the printed circuit board, PEI selects the manufacturing material to maximize the device’s operating life for any given application or environment.
For more information, visit: www.photofabrication.com.