Fujipoly has announced the introduction of Sarcon GR25A-00-50GY, an extremely soft thermal gap filler pad that also exhibits a very low thermal resistance. This thermally conductive silicone-based material easily conforms to most component shapes and board protrusions while exhibiting very low pressure.
When placed between a heat source such as a semiconductor and a nearby heat sink, this 0.5mm thick TIM provides a thermal conductivity of 2.50 W/m°K and a thermal resistance as low as .18 °Cin2/W. Sarcon GR25A-00-50GY is available in convenient pre-cut sheets up to a maximum size of 200mm x 300mm (max.) and can also be die cut to your exact application specifications.
For more information, visit: www.fujipoly.com.