Over the last several years hundreds of major electronics manufacturers have expanded their use of LED lighting to enhance both product appearance and functionality. Recent design trends have integrated LED lighting packages in thousands of consumer and industrial electronic platforms that range from aircraft landing systems to automotive headlights and complex industrial control panels.
One of the most challenging issues with the use of LEDs is the control of unwanted heat. The most common way to dissipate this performance-hindering byproduct is to connect the LED package directly to a heat sink. To maximize the cooling performance of the heatsink, Fujipoly offers its line extremely soft Sarcon GR-ae thermal interface materials. The gel-like sheet compound is designed to efficiently transfer heat from its source to the nearby heat sink. The unique physical properties of this material allow it to protect delicate board-level components as they fill unwanted air gaps and levels uneven surfaces.
For more information, visit www.fujipoly.com.