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Samtec’s line of high-speed edge card solutions now includes a new high-density edge card socket (BEC5C Series) featuring up to 140 total contacts on 0,50 mm pitch. This micro card socket is ideal for high-speed applications requiring b oard space savings. The dual beam bi-level contact system is on a staggered 0,5 mm pitch, which reduces card-mating force without reducing reliability. This vertical socket is available for both .062" (1,60 mm) and .093" (2,36 mm) card thicknesses. 

For more information, visit www.samtec.com.

 

 

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