Featuring the combination of electrical insulation properties and thermal conductivity, Master Bond Supreme 3HTND-2GT can be used for a variety of applications including bonding, sealing, glob top and die attach. This toughened epoxy system bonds well to a wide variety of substrates used in electronics, including metals, composites, ceramics and many plastics.
As a one component system, Supreme 3HTND-2GT does not require mixing and features a thicker viscosity with limited flow characteristics. Unlike many epoxies it can be readily and efficiently applied to a defined area. It cures quickly in 20-30 minutes at 250°F or in 5-10 minutes at 300°F with very low shrinkage. Supreme 3HTND-2GT can cure in thicknesses of up to 1/8 inch if needed.
For more information, visit www.masterbond.com