Leica Microsystems launched the Leica DCM8 for non-destructive three-dimensional surface profiling. The instrument is a combined confocal and interferometric optical profiler and therefore provides the benefits of both technologies: high definition confocal microscopy for high lateral resolution and interferometry to reach sub-nanometer vertical resolution. Both techniques can be important for surface analysis of materials and components across numerous research and production environments.
Surfaces that are made up of intricate structures with highly sloping areas demand lateral resolution of a few microns. In contrast to this, polished super-smooth surfaces with critical micro peaks and valleys require vertical analysis on the nanometer scale.
For more information, visit www.leica-microsystems.com