TTI announced the company will distribute 3M’s new 1.27mm IDC connectors in the Americas. All of the advanced features that have made 3M’s IDC connectors the standard throughout the world are offered in a smaller footprint for even more cost effective solutions.
The shrouded boardmount header is available in a variety of configurations in order to maximize design flexibility while minimizing PCB footprint. Tape-and-reel packaging for the SMT version of the header is available for automated placement applications, and PCB standoffs help enable pin-in-paste processing capability.
For more information, visit www.ttiinc.com