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Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX, at Semicon China on March 18-20 in Shanghai, China. BiAgX was created specifically for high-reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.

BiAgX is excellent for small, low-voltage QFN packages that are used in portable electronics such as smartphones and tablets. It excels in high temperature environments in excess of 150°C, requires minimal process adjustments, and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process.

For more information, visit www.indium.com.

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