AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation
AI Technology, Inc. (AIT) has solved one of the technically more challenging problems in wafer level semiconductor packaging to achieve conductive die-attach film adhesive (DAF) of 20 micron thickness. While die-attach film adhesive (DAF) at the wafer level is becoming more prevalent in die-attach for memory modules in precision bonding and thin packages, thermally conductive and electrically conductive die-attach film is more limiting because of the challenging handling and performance issues for the thinner conductive DAF.
AIT’s conductive DAF is built on the same self-supporting die-attach film (DAF) adhesive technology that the company pioneered in the 1990’s. AIT is now able to produce ESP8660-HK in 20 micron thickness for power devices from microprocessors to concentrated solar die-attach modules. This new thickness marks an improvement over AIT’s 50 microns thick ESP8660-HF which was first produced in 2005.
ESP866-HF can be produced in wafer-shape die-cut format and pre-laminated on dicing tape (DDAF) format up to widths of 450mm and lengths of 100 meters in AIT’s clean room manufacturing environment housed in the company’s 16 acres facilities in Princeton Junction, NJ.
Not only is ESP8660-HK available in 20 micron thickness, it is also developed for high glass transition requirements to facilitate faster wire-bonding at temperatures as high as 250°C. ESP8660-HK is also molecularly engineered to reduce stress and ultimately improve the reliability of multi-chip module (MCM) and system in package (SIP) devices.
In addition to achieving one of the lowest thermal resistances with thermal conductivity of over 8 W-m/°K, ESP8660-HK maintains its bond strength after 85%RH/85°C and demonstrates reliability test results after thermal cycling and shock that are not common even for traditional paste die-attach adhesives.