Microelectronics Assembly & Packaging Solutions

Crane Microelectronics Solutions specializes in unique microelectronic assembly and packaging solutions for our customers that require an innovative approach to reducing size, weight, increasing performance and resolving circuit density challenges while maintaining high reliability. Crane works with a variety of applications in the Aerospace, Defense, Medical, Industrial and Commercial markets which require our ability to build-to-print, co-develop and provide turnkey services. We strive to meet customers time-to-market and time-to-volume demands. Our facility is ITAR registered and certified to MIL-PRF-38534 Class H and K, ISO 13485, as well as to ISO 9001 and AS9100 assuring quality in all our services including design, development, assembly and test. High-density microelectronic module assembly Test system development Validation to ensure quality and reliability Re-design for obsolescence Thick film technology Surface mount or mixed technology assembly Chip and Wire, Chip on Board, Chip on Flex uBGA, Flip Chip, Chip Scale Package